![]() Since the gap between metallic balls is negligible in these PCBs, this technology is used to test under layer uniformity of the board surface. X-ray laminography is a technique commonly utilized for flat surfaces. One or more of the following techniques of microscopic evaluation are used for the inspection. The microscopic inspection is for voids or defects lower than 10 microns. Therefore, these ball grid PCBs are tested by shock tests, scrap tests, etc. Since they are subjected to external forces, vibrations, shocks, and electrical fluctuations. ![]() The mechanical inspection of these PCBs is a destructive method. Since visual inspection with naked human eyes does not suffice for this type of PCB evaluation, therefore the optical inspection under an endoscope is performed. The optical inspection involves visual testing of circuit boards. Under the BGA evaluation, three types of inspection are covered, namely, optical, mechanical, and microscopic inspection. The internal voids in the solder joints should not exceed 20% size of the ball diameter.ĭifferent Methods of Ball Grid Array Inspection The solder reflow traces are inspected for acceptance. Since the BGAs may involve high-density regions where a large number of metallic balls are placed, such locations require critical thermal management. The solder reflow profile must be performed with appropriate thermal management. These PCBs are often inspected for the following defects. Although there is a lack of defined industrial documentation to increase the success rate of the BGA devices the following acceptance criteria are helpful.įurther, these types of PCBs are accepted if minimum defects are found. Therefore, PCB manufacturers are facing a higher rejection rate. The ball grid PCB assembling or packaging technology is one of the complex packaging technologies, the conventional inspection methods do not suffice. This post discusses the acceptance criteria of ball grid array challenges and a few techniques to inspect the same. In order to fulfill the acceptance criteria, the evaluation of ball grid packaging is essential. Although it has become a standard element in modern PCB packaging, it is not widely accepted like other technologies. This technology is rapidly replacing the dual-in-line and flat packaging techniques. This technology includes the positioning of small balls in a particular manner on electronic boards using surface mount technology (SMT). Ball Grid Array (BGA): Acceptance Criteria and Inspection Techniquesīall grid array (BGA) has advanced from pin grid array (PGA) PCB packaging technology.PCB Assembly for High Temperature Electronics.Computer and Business Electronics Products.Small Volume Printed Circuit Board Assembly Services.Multilayer Printed Circuit Board Assembly Services.Lead-Free Printed Circuit Board Assembly Services.Large Volume Printed Circuit Board Assembly Services.
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